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Q1.Who is Capella Microsystems? |
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A1.Capella Microsystems designs, develops, and markets high-speed, high-performance analog and analog/digital mixed signal integrated circuits (ICs) for optical systems. |
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A2.Integrated photodiode and transimpedence (I/V) amplifiers or PDICs convert optical signals to electrical ones. This single chip solution can be used in everything from optical storage devices to infrared detection products to fiber optic networks. The photodetector on the chip catches the light of the optical signal, which is a form of current, and the transimpedence amplifier converts that current into an output voltage. |
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Q3.What is the advantage of using Capella PDICs? |
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A3.For optical pickup manufacturers, Capella PDICs provide excellent gain sensitivity for better performance, virtually zero PD-reflection (especially important in recordable devices), and faster detection speeds. Low power. |
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Q4.How do PDIC speeds affect the X-speeds? |
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A4.For CD-ROM and DVD-ROM drives, speed is measured through its data transfer rate. 1xCD equals about 1.2 Mbps. 1xDVD equals about 11Mbps. Because of different optical pickup unit manufacturers' read-ahead RAM buffers and motor speeds, which also improve read performance, there is no defined formula to associate PDIC-speeds to X-speeds. The more accurate method of determining PDIC speed is its cutoff frequency, which can be anywhere from 6-8MHz for CD-players (audio/video), 16-24MHz for DVD-players, or even 120-150MHz for 16xDVD-ROM drives. |
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Q5.What makes Capella's PDICs different? |
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A5.Capella PDICs are the first to use a CMOS process to provide a high level of performance with an integrated photodiode and transimpedence amplifier. PDICs have traditionally been supplied by manufacturers using BiCMOS or BiPolar processes. As a fabless and package-less company, Capella chose to develop in CMOS because the propensity and availability of CMOS manufacturing is greater worldwide than advanced BiCMOS or BiPolar facilities. Capella's unique approach allows CMOS to achieve much better performance than previously thought possible. |
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Q6.Where is Capella's manufacturing facility? |
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A6.Capella is a fabless company, meaning our production efforts are outsourced. The advantage is that we can quickly improve our product offerings by qualifying vendors who have new or more advanced technology, such as moving to smaller process geometries or leveraging packaging innovations like COB (chip on-board) or CSP (chip scale packaging) or CMP(Clear Mode Plastic )technology. We're strategically partnered with the largest foundry in the world, ensuring our ability to keep our customers supplied. |
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Q7.What are the different packaging options Capella PDICs offers? |
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A7.The industry standard packaging is known as a lead frame package with a clear mode plastic (CMP) seal that encloses the actual PDIC and provides extended leads for soldering. Capella also offers COB or chip on-board packaging that does not require the lead frames or plastic enclosure, allowing for a much smaller, cost-effective part. Continuing in this direction, Capella is also sampling CSP (chip scale packaging) that reduces the chip size even more and enhances manufacturing because the PDICs signal I/Os are located at the edge of the package and require less PCB layers. We can also supply our customers uncut wafers so they can determine their own packaging. |
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